1.FEATURES Low Voiding Excellent Print Transfer Efficiencies Eliminates HiP Defects REACH and RoHS* Compliant Powerful Wetting on All Surface Finishes Print Speeds up to 200mm/sec 2. DESCRIPTION AIM NCH88 no clean solder paste provides Class III performance to the value minded customers. NCH88 provides stable transfer efficiencies required to ensure long print life in all production environments. NCH88 performance ensures high operator satisfaction while reducing DPMO on the most challenging applications. NCH88 innovative activator chemistry provides powerful, durable wetting action accommodating a wide range of profiling processes and equipment. NCH88 will reduce wetting related defects such as HiP (head-in-pillow) and always provides smooth shiny joints. NCH88 has shown reduced BGA and BTC voiding to as low as<5% on BGA and <10% on BTC ground pads NCH88沒有干凈的錫膏性能提供了第三類的客戶價(jià)值。NCH88提供穩(wěn)定的傳輸效率要求確保所有生產(chǎn)環(huán)境中打印壽命長。NCH88性能確保高運(yùn)營商滿意度同時(shí)減少DPMO在具挑戰(zhàn)性的應(yīng)用程序。NCH88創(chuàng)新活化劑化學(xué)提供了強(qiáng)大的,持久的潤濕作用適應(yīng)范圍廣泛的分析流程和設(shè)備。NCH88將減少潤濕等相關(guān)缺陷臀部(head-in-pillow),總是提供光滑閃亮的關(guān)節(jié)。N