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FP4801 provides the following product characteristics:
Technology Epoxy
Appearance Black
Cure Heat cure
Product Benefits ● High purity
● Excellent flow properties
● 260oC reflow capability for Pb-free
applications
● Meets "Green", non-halide
requirements
Application Encapsulant
Typical Applications Potting Dam, Cavity fill or Bare chip
protection
Typical Package
Application
BGA, CSP, PBGA and Full arrays on
LTCC
FP4801 liquid encapsulant is formulated for use in
applications requiring Pb-free solder. This material is designed
for temperature cycling ranges from -65 to 150°C. FP4801
features excellent flow properties allowing it to penetrate fine
pitch wires and deep cavities without entrapping voids.
.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield - HBT, 25 °C, mPa·s (cP):
Spindle 7, speed 10 rpm 100,000
Specific Gravity @ 25oC 1.76
Filler Content , ash, % 72
Pot life @ 25 °C, (Time required to double vis
