1.Features .Halogen-Free per EN14582 test method .High transfer effi ciency through small apertures (. 0.66AR) .Eliminates hot and cold slump .High oxidation resistance .Wets well to oxidized BGA and pad surfaces .Excellent soldering performance under high temperature and long refl ow processes .Clear, probe testable fl ux residue .Backward compatible with Sn/Pb alloys 2.Introduction Indium8.9HF is an air refl ow, no-clean solder paste specifi cally formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, and other alloy systems favored by the electronics industry to replace conventional Pb- bearing solders. Indium8.9HF offers unprecedented stencil print transfer effi ciency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9HF minimizes false failures in ICT. 3.Alloys Indium免洗錫膏，SAC305無鉛錫膏 Indium Corporation manufactures low-oxide spherical powder composed of a variety of Pb-Free alloys that cover a broad range of melting temperatures. Type 4 and Type 3 powder are standard offerings with SAC3 05 & SAC387 alloys. The metal percent is the weight percent of the solder powder in the solder paste and is dependant upon the powder type and application. Standard product offerings are detailed in the following table.