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美國(guó)UDM AKLC300系列濃縮晶圓切削液
AKLC300洗滌劑濃縮液是一種可生物降解、水性、非堿性、非酸性物質(zhì)
PV wafer Cleaning after wafering
用于切片之后對(duì)光伏硅片進(jìn)行清洗
DI /RO water: Detergent dilution ratio – 1000:1 to 500 :1
去離子水/反滲透水:洗滌劑溶液比例 – 1000:1至500:1
Application temperature: 45°C - 70°C
使用溫度：45°C - 70°C
Excellent wetting, cleaning and rinsing properties
極好的濕潤(rùn)、清潔和沖洗功能
Water surface tension reducer
降低去離子水/反滲透水表面張力
Completely cleans out SiC (silicon carbide) dust and other contaminants on wafer surfaces
可以徹底清潔硅片表面的碳化硅(SiC)塵埃以及其他臟污
Cleans and eliminates Cu (Copper) and Fe (Iron) on PV wafer surfaces after wafering and De-gluing process.
在切片以及去膠工序之后徹底清除光伏硅片表面的銅和鐵
Biodegradable, non-hazardous and hence easily disposable
可生物降解、無(wú)危害，可以很容易進(jìn)行處置
Biochemical Oxygen Demand (BOD) < 2.0 mg/L (BOD less than 2.0 mg/L)
生化需氧量(BOD) < 2.0 mg/L (BOD小于2.0 mg/L)
Chemical Oxygen Demand (COD) < 10.0 mg/L (COD less than 10.0 mg/L)
化學(xué)需氧量(COD) < 10.0 mg/L (COD小于10.0 mg/L)
聯(lián)系人：陳先生
手機(jī)：13602588976
